Expandable Architecture And Bus For Consumer Gateway

ABSTRACT

The embodiments include a stackable computing device that includes an integrated heatsink and antenna structure and a housing structure. The housing structure includes a housing casing that surrounds the integrated heatsink and antenna structure. The integrated heatsink and antenna structure includes a heatsink base and one or more radio frequency (RF) antenna portions. The heatsink base includes a connector port that provides an interface between components of the computing device and other computing or peripheral devices. For example, the heatsink base may include platform that is configured to have circuitry fixedly secured on a first side of the platform with a connector of the circuitry aligned with an aperture of the connector port such that a connection to the circuitry is accepted by circuitry of another computing device.

This application claims the benefit of priority to U.S. ProvisionalApplication No. 62/952,937, entitled “Expandable Architecture And BusFor Consumer Gateway” filed Dec. 23, 2019, the entire contents of whichare hereby incorporated by reference for all purposes.

BACKGROUND

Wireless communication technologies have been growing in popularity anduse over the past several years. This growth has been fueled by bettercommunications hardware, larger networks, and more reliable protocols.Wireless and Internet service providers are now able to offer theircustomers with an ever-expanding array of features and services, such asrobust cloud-based services.

To better support these enhancements, more powerful consumer facing edgedevices (e.g., consumer grade access points, IoT gateways, routers,switches, etc.) are beginning to emerge. These devices include morepowerful processors, system-on-chips (SoCs), memories, antennas, poweramplifiers, and other resources (e.g., power rails, etc.) that bettersupport high-speed wireless communications and execute complex and powerintensive applications facilitating edge computing.

In addition to high performance and functionality, consumersincreasingly demand that their devices be affordable, future-proof(e.g., upgradeable, highly versatile, etc.) and small enough to readilyplaced throughout a home or small office.

SUMMARY

The various aspects include a computing device (stackable computingdevice) that includes an integrated heatsink and antenna structure thatincludes a heatsink base and one or more radio frequency (RF) antennaportions, and a housing structure that includes a housing casing thatsurrounds the integrated heatsink and antenna structure, in which theheatsink base of the integrated heatsink and antenna structure includesa connector port that provides an interface between components of thecomputing device and other computing or peripheral devices.

In some aspects, the connector port may include an electro-mechanicalinterface that provides access to unused system busses and resources ofthe computing device after deployment in the field. In some aspects, theconnector port may be configured to allow additional computing devicesto be stacked onto the computing device to form a combined unit thatoperates as a single unified computing device. In some aspects,components of the computing device may be configured to operate so as toprovide a baseline feature set, and the additional stacked computingdevices may expand or enhance the baseline feature set by adding to thememory, processing, or communication resources to the computing device.

In some aspects, the connector port may be configured to allow thecomputing device and the additional computing devices to use a commoncommunication and power bus interface. In some aspects, the one or moreRF antenna portions may include at least one or more of a long termevolution (LTE) antenna portion, a fourth generation wireless mobilecommunication technology (4G) antenna portion, a fifth generationwireless mobile communication technology (5G) antenna portion, or aglobal positioning system antenna portion.

In some aspects, the housing structure may include a housing casingconfigured to surround an integrated heatsink and antenna structureremovably secured therein (in which the housing casing forms an innercavity for holding the integrated heatsink and antenna structure), ahousing cover removably secured to a top side of the housing casing sothat when secured to the topside of the housing casing the housing coverconceals the inner cavity from view from the top side of the housingcasing, and a housing base removably secured to a bottom side of thehousing casing so that when secured to the bottom side of the housingcasing the housing base conceals the inner cavity from view from thebottom side of the housing casing, in which removal of at least one ofthe housing cover or the housing base allows an additional unit to bestacked with and coupled to the integrated heatsink and antennastructure secured with the housing casing.

In some aspects, the housing casing may be configured to surround anintegrated heatsink and antenna structure that may include a heatsinkbase and one or more radio frequency (RF) antenna portions. In someaspects, the housing casing may be configured to surround an integratedheatsink and antenna structure that may include a connector port thatprovides an interface between components of the integrated heatsink andantenna structure and other computers or peripheral devices.

In some aspects, removal of at least one of the housing cover or thehousing base allows a computing device to be stacked with and coupled tothe integrated heatsink and antenna structure secured with the housingcasing. In some aspects, removal of at least one of the housing cover orthe housing base allows a second integrated heatsink and antennastructure cased in a second housing to be stacked with and coupled tothe integrated heatsink and antenna structure secured with the housingcasing.

In some aspects, the integrated heatsink and antenna structure mayinclude a cavity onto which at least one of a processor, a computingsystem, a printed circuit board, an integrated circuit (IC) chip, asystem on chip (SOC), or a system in a package (SIP) may placed, and thehousing casing may be configured to surround the integrated heatsink andantenna structure and the at least one processor, computing system,printed circuit board, IC chip, SOC or SIP placed onto the cavity of theintegrated heatsink and antenna.

In some aspects, the housing casing may be configured to surround anintegrated heatsink and antenna structure that may include a radiofrequency antenna portion and a heatsink portion, the radio frequencyantenna portion operates to improve the thermal performance of theheatsink portion, and the heatsink portion operates to improve one ormore antenna properties of the radio frequency antenna portion.

In some aspects, the heatsink base of the integrated heatsink andantenna structure of the stackable computing device may include a framestructure, a plurality of fin components projecting outwardly from theframe structure (the plurality of fin components being configured toreceive and hold one or more radio frequency (RF) antenna portions) anda platform substantially surrounded by the frame structure. The platformmay include an aperture extending through the platform to provide orsupport a connector port. The platform may be configured, equipped,arranged, formed or shaped to have circuitry fixedly secured on a firstside of the platform with a connector of the circuitry aligned with theaperture such that a connection to the circuitry is accepted bycircuitry of another heatsink base through the aperture from an opposedsecond side of the platform. In some aspects, the circuitry fixedlysecured on the first side of the platform may include anelectro-mechanical interface that provides access to unused systembusses and resources after deployment in the field.

In some aspects, the platform of the heatsink base may be a planarstructure forming a partition of an inner cavity within the framestructure. In some aspects, a first portion of the inner cavity on thefirst side of the platform may larger than a second portion of the innercavity on the second side of the platform. In some aspects, the framestructure may have a rectangular or square form. In some aspects, theframe structure may be shaped to improve the omnidirectional pattern ofthe one or more RF antenna portions.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are incorporated herein and constitutepart of this specification, illustrate exemplary aspects of the claims,and together with the general description given above and the detaileddescription given below, serve to explain the features of the claims.

FIG. 1A is a schematic isometric view of an integrated heatsink andantenna structure in accordance with various embodiments.

FIG. 1B is a front elevation view of the integrated heatsink and antennastructure of FIG. 1A in accordance with various embodiments.

FIGS. 2A-C are isometric, top, and side views, respectively of anintegrated heatsink and antenna structure that include multiple radiofrequency (RF) antennas with corresponding heat sink portions inaccordance with some embodiments.

FIG. 3 is a partially exploded isometric view of the integrated heatsinkand antenna structure of FIG. 2A.

FIG. 4 is an isolated top view of a heatsink base component inaccordance with various embodiments.

FIGS. 5A and 5B are exploded and assembled isometric views,respectively, of stackable housings for integrated heatsink and antennastructures in accordance with various embodiments.

FIG. 6A is an isometric view of two of the stackable housings shown inFIGS. 5A and 5B stacked on top of and couple to one another inaccordance with some embodiments.

FIG. 6B is an isometric view of three of the stackable housings stackedon top of one another in accordance with some embodiments.

FIGS. 6C and 6D are component block diagrams illustrating that the baseunit and the additional units may be attached in a variety of differentways and/or to form a variety of different configurations in someembodiments.

FIGS. 7A and 7B are component block diagrams illustrating a computingsystem that includes an expandable architecture and a stack connector inaccordance with some embodiments.

FIG. 8-10 are component block diagrams illustrating different that thecomputing system may be stacked or combined in various differentconfigurations in some embodiments.

DETAILED DESCRIPTION

Various aspects will be described in detail with reference to theaccompanying drawings. Wherever possible, the same reference numberswill be used throughout the drawings to refer to the same or like parts.References made to particular examples and implementations are forillustrative purposes, and are not intended to limit the scope of theclaims.

In overview, the embodiments include a stackable computing device (e.g.,edge device, etc.) that includes a baseline feature set, and anexpandable architecture that allows end users to add specific featuresor functionality (e.g., digital concierge, home assistant, etc.) to thedevice as needed. The expandable architecture allows end users topurchase a relatively inexpensive base unit, and upgrade or customizethe device's features or capabilities based on their specific needs. Theexpandable architecture also allows the device to remain compatible withthe fast-paced evolving technology roadmap confronting 5G and beyond.Rather than replacing the device with another that better supports thesenew and emerging features, the end user may add features sets to theexisting device.

The stackable computing device may be a base unit, or a combined unitthat includes a base unit and additional units. The base unit and itscomponents may be configured, shaped, formed or arranged so that thecustomer or user can quickly physically attach additional units (e.g.,an auxiliary unit, another base unit, etc.) above, below, or to thesides of the base unit. The additional units may be other base units orindependent computing systems that are capable of operating on theirown. As is discussed in more detail below, the additional units beattached in a variety of different ways and/or to form a variety ofdifferent configurations. Once attached, the combined unit (i.e., thebase unit and the attached additional units) may operate as a singleunified computing device (or a single unified edge device).

The additional units may expand or enhance the baseline feature set ofthe base unit by adding to the existing memory, processing, and/orcommunication resources of the base unit. The additional units may alsoexpand the baseline feature set by adding new resources or capabilitiesto the base unit, such as support for a new radio access technology,decoding audio, processing light, receiving external inputs, addingexternal relay contacts to, for example, turn other devices on or off,receive inputs from external devices, etc.

Any or all of the units in the combined unit may expose systems busesand resources in a manner that allows those units to be readily expandedto support additional feature sets, but which preserves the performanceand integrity of the individual units and of the combined device. Theadditional units may have additional system buses that may or may not bepart of the system bus of the base unit. The exposure of these and otherbuses may help ensure the future expandability of the combined unit.

In some embodiments, the stackable computing device may include anelectro-mechanical interface such that unused system busses andresources may be accessed and/or retro-fitted by the end user, afterdeployment, or in the field. In some embodiments, such as the embodimentillustrated in FIG. 2A, the electro-mechanical interface may bepositioned on the top or bottom of the stackable computing device tosupport vertical stacking. In some embodiments, such as the embodimentillustrated in FIG. 8, the electro-mechanical interface may bepositioned on the side of the stackable computing device to supporthorizontal stacks. In some embodiments, two or more electricalmechanical interfaces may be used. For example, one electricalmechanical interface may be used to connect to the base unit orhigher-level unit, and other mechanical interfaces may be used toconnect to other units. The electro-mechanical interfaces may or may notbe included in the same bus depending on the functionality the unit orunits perform. Additionally, an interface plug may be connected to oneof the exposed electro-mechanical interfaces, facilitating differentconnection and interface options. The interface plug may also includethe necessary hardware to perform protocol and or level conversions.

In some embodiments, the electro-mechanical interface may be configuredto facilitate the user interfacing the base unit with a component thatprovides quantum computing capability. The unit or units connecteddirectly to or relayed by other units may include quantum computingcapability interfacing and leveraging the base processing and otherfunctions of the base unit and the associated units.

In some embodiments, the electro-mechanical interface may be configuredto provide connectivity for additional power sources, which may be tiedto the existing power bus for unit expansion.

The various embodiments may include, use, incorporate, implement,provide access to a variety of wired and wireless communicationnetworks, technologies and standards that are currently available orcontemplated in the future, including any or all of Bluetooth®,Bluetooth Low Energy, ZigBee, LoRa, Wireless HART, Weightless P, DASH7,RPMA, RFID, NFC, LwM2M, Adaptive Network Topology (ANT), WorldwideInteroperability for Microwave Access (WiMAX), WIFI, WiFi6, WIFIProtected Access I & II (WPA, WPA2), personal area networks (PAN), localarea networks (LAN), metropolitan area networks (MAN), wide areanetworks (WAN), networks that implement the data over cable serviceinterface specification (DOCSIS), networks that utilize asymmetricdigital subscriber line (ADSL) technologies, third generationpartnership project (3GPP), long term evolution (LTE) systems,LTE-Direct, third generation wireless mobile communication technology(3G), fourth generation wireless mobile communication technology (4G),fifth generation wireless mobile communication technology (5G), globalsystem for mobile communications (GSM), universal mobiletelecommunications system (UMTS), high-speed downlink packet access(HSDPA), 3GSM, general packet radio service (GPRS), code divisionmultiple access (CDMA) systems (e.g., cdmaOne, CDMA2000™), enhanced datarates for GSM evolution (EDGE), advanced mobile phone system (AMPS),digital AMPS (IS-136/TDMA), evolution-data optimized (EV-DO), digitalenhanced cordless telecommunications (DECT), etc. Each of these wiredand wireless technologies involves, for example, the transmission andreception of data, signaling and/or content messages.

Any references to terminology and/or technical details related to anindividual wired or wireless communications standard or technology arefor illustrative purposes only, and not intended to limit the scope ofthe claims to a particular communication system or technology unlessspecifically recited in the claim language.

The term “computing device” may be used herein to refer to any one orall of quantum computing devices, edge devices, Internet accessgateways, modems, routers, network switches, residential gateways,access points, integrated access devices (IAD), mobile convergenceproducts, networking adapters, multiplexers, personal computers, laptopcomputers, tablet computers, user equipment (UE), smailphones, personalor mobile multi-media players, personal data assistants (PDAs), palm-topcomputers, wireless electronic mail receivers, multimedia Internetenabled cellular telephones, gaming systems (e.g., PlayStation™, Xbox™,Nintendo Switch™, etc.), wearable devices (e.g., smartwatch,head-mounted display, fitness tracker, etc.), IoT devices (e.g., smarttelevisions, smart speakers, smart locks, lighting systems, smartswitches, smart plugs, smart doorbells, smart doorbell cameras, smartair pollution/quality monitors, smart smoke alarms, security systems,smart thermostats, etc.), media players (e.g., DVD players, ROKU™,AppleTV™, etc.), digital video recorders (DVRs), and other similardevices that include a programmable processor and communicationscircuitry for providing the functionality described herein.

The term “quantum computing device” may be used herein to refer to acomputing device or edge device, whether it is a standalone device orused in conjunction with current computing processes, that generates ormanipulates quantum bits (qubits) or which utilizes quantum memorystates. A quantum computing device may enhance edge computing capabilityby providing solutions that would be challenging to implement viaconventional computing systems. This is especially true with value addedcomputing for leveraging a diverse amount of senor and other input datato arrive at a solution in real time. Through unifying diverse datasources a quantum computing solution at the edge may accelerate machinelearning, solve complex problems faster as well as provide thefundamental platform for artificial intelligence nodes at the edge ofthe network. With the vast array of data delivered by sensors as wellstate information the quantum computing process may improve the memoryallocation though the use of superposition allowing for more informationto be simultaneously stored and processed.

The term “edge device” may be used herein to refer to a computing devicethat includes a programmable processor and communications circuitry forestablishing communication links to consumer devices (e.g., smaltphones, UEs, IoT devices, etc.) and/or to network components in aservice provider, core, cloud, or enterprise network. For example, anedge device may include or implement functionality associated any one orall of an access point, gateway, modem, router, network switch,residential gateway, mobile convergence product, networking adapter,customer premise device, multiplexer and/or other similar devices.

Various different types of antennas are available or contemplated in thefuture. To focus the discussion on the most important details, someembodiments are described with reference to planar inverted-F antennas.However, nothing in this application should be use to limit the scope ofthe claims to a specific type antenna unless expressly recited as suchin the claims.

Generally, components and circuitry within a computing device (e.g.,base unit, combined unit, etc.) generate heat or thermal energy, whichat excessive levels may damage or reduce the performance of thecomputing device. The amount of thermal energy that is generated mayvary depending upon the components included in the computing device,operating conditions, and/or the operations or activities in thecomputing device. For example, a computing device that wirelesslytransmits data for a sustained time period at a high power-level mayrequire that a power amplifier feed its antennas. The power amplifiermay generate a significant amount of thermal energy that could have anegative impact on the performance of the computing device. As anotherexample, processors and other components in the computing devicegenerate a significant amount thermal energy when the performing complextasks, such as processing video, using cryptographic technology, orimplementing machine learning. The thermal energy generated by theseprocessors/components could damage the device, shorten the operatinglife of the device, cause the device to abruptly shut down, or otherwisehave a negative impact on the device's reliability or performancecharacteristics.

Many modern computing systems are equipped with heat dissipatingstructures that help ensure the device does not operate at unsafetemperatures that damage or shorten the operating life of the device.Modern computing systems are often also equipped with radiatingstructures (antennas) for sending and receiving wireless communications.

In many conventional systems, the heat dissipating structures areseparate and independent of radiating structures, and thus compete withone another for product volume (e.g., space with in the device). Forthese and other reasons, device manufacturers have had to either builddevices that are large enough to include both the heat dissipating andradiating structures (e.g., personal computers, laptops, routers, etc.)or build smaller but less powerful devices (e.g., smal tphones, IoTdevices, etc.) that attempt to balance tradeoffs between performance andpower consumption. Device manufacturers that opt to build the small andmid-sized devices often carve away sections of the heat dissipatingstructure (heatsinks) to make room for the radiating structures(antennas), or vice versa. The tradeoff or reduction in heat dissipationstructure size for antenna installation reduces the thermal performanceof the device because it decreases the surface area of the heatdissipating structure. This also degrades the radiation patterns on theradiating structures and may otherwise have a negative impact on thedevice's performance or reliability.

In some embodiments, the stackable computing device may include anintegrated heatsink and antenna structure. The integrated heatsink andantenna structure may be configured or arranged so that it is suitablefor inclusion in small and midsized computing devices and/or to overcomethe above-described limitations of conventional solutions.

In some embodiments, the integrated heatsink and antenna structure mayinclude heatsink portions and RF antenna portions. The heatsink portionsmay provide a path for dissipating thermal energy or heat generated bythe components in the device (e.g., printed circuit boards, processors,voltage amplifiers, etc.). The RF antenna portions may allow the deviceto send and receive wireless communications.

In some embodiments, the integrated heatsink and antenna structure maybe formed so that RF antenna portions operate to improve the thermalperformance of the heatsink portions and/or so that the heatsinkportions operate to improve the antenna properties (e.g., radiationpatterns, radiation efficiency, bandwidth, input impedance,polarization, directivity, gain, beam-width, voltage standing waveratio, etc.) of the RF antenna portions. These improvements in thermalperformance and/or antenna properties may allow device manufacturers tobuild more powerful small and midsized devices that provide robustfunctionality (e.g., via additional antennas, more powerful processorsthat generate more heat, etc.) and which may be formed into morevisually appealing shapes.

In some embodiments, the stackable computing device may include ahousing structure that includes a housing casing that surrounds theintegrated heatsink and antenna structure. The integrated heatsink andantenna structure may include a heatsink base and one or more radiofrequency (RF) antenna portions. The RF antenna portions may include atleast one or more of an LTE antenna portion, a 5G antenna portion, or aGPS antenna portion.

In some embodiments, the heatsink base of the integrated heatsink andantenna structure may include a connector port that provides aninterface between components of the computing device and other computingor peripheral devices. In some embodiments, the connector port mayinclude an electro-mechanical interface that provides access to unusedsystem busses and resources of the computing device after deployment inthe field. In some embodiments, the connector port may be configured toallow additional computing devices to be stacked onto the computingdevice to form a combined unit that operates as a single unifiedcomputing device. In some embodiments, the components of the computingdevice included on the integrated heatsink and antenna structure mayoperate to provide a baseline feature set, and the additional stackedcomputing devices expand or enhance the baseline feature set by addingto the memory, processing, or communication resources to the computingdevice. In some embodiments, the connector port may be configured toallow the computing device and the additional computing devices to use acommon communication and power bus interface. In some embodiments, theRF antenna portions include at least one or more of an LTE antennaportion, a 5G antenna portion, or a GPS antenna portion.

In some embodiments, the housing structure of the stackable computingdevice may include a housing casing, a housing cover, and a housingbase. The housing casing be configured, shaped or formed to surround theintegrated heatsink and antenna structure (which is removably securedtherein). The housing casing may form an inner cavity for holding theintegrated heatsink and antenna structure.

The housing cover may be removably secured to a top side of the housingcasing so that, when secured to the topside of the housing casing, thehousing cover conceals the inner cavity from view from the top side ofthe housing casing. The housing base may be removably secured to abottom side of the housing casing so that, when secured to the bottomside of the housing casing, the housing base conceals the inner cavityfrom view from the bottom side of the housing casing.

The housing structure and/or the stackable computing device may beconfigured, equipped or arranged such that removal of the housing coveror the housing base may allow an additional unit (e.g., anotherstackable computing device, etc.) to be stacked with and coupled to theintegrated heatsink and antenna structure secured with the housingcasing. For example, the housing structure and/or the stackablecomputing device may also be configured, equipped or arranged such thatremoval of at least one of the housing cover or the housing base allowsa second integrated heatsink and antenna structure cased in a secondhousing to be stacked with and coupled to the integrated heatsink andantenna structure secured with the housing casing.

In some embodiments, the integrated heatsink and antenna structure mayinclude a heatsink base, one or more radio frequency (RF) antennaportions, and/or a connector port that provides an interface betweencomponents of the computing device and other computers or peripheraldevices (e.g., additional units, etc.).

In some embodiments, the integrated heatsink and antenna structure mayinclude a cavity onto which at least one of a processor, a computingsystem, a printed circuit board, an integrated circuit (IC) chip, asystem on chip (SOC), or a system in a package (SIP) may placed.

In some embodiments, the housing casing may be configured, equipped,arranged, formed or shaped to surround the integrated heatsink andantenna structure and the at least one processor, computing system,printed circuit board, integrated circuit (IC) chip, system on chip(SOC), or system in a package (SIP) placed onto the cavity of theintegrated heatsink and antenna.

In some embodiments, the housing casing may be configured, equipped,arranged, formed or shaped to surround an integrated heatsink andantenna structure that includes a radio frequency antenna portion and aheatsink portion. In some embodiments, the radio frequency antennaportion may operate to improve the thermal performance of the heatsinkportion, and the heatsink portion may operate to improve one or moreantenna properties of the radio frequency antenna portion.

In some embodiments, the heatsink base of the integrated heatsink andantenna structure of the stackable computing device may include a framestructure, a plurality of fin components projecting outwardly from theframe structure (the plurality of fin components being configured toreceive and hold one or more radio frequency (RF) antenna portions) anda platform substantially surrounded by the frame structure. The platformmay include an aperture extending through the platform to provide orsupport a connector port. The platform may be configured, equipped,arranged, formed or shaped to have circuitry fixedly secured on a firstside of the platform with a connector of the circuitry aligned with theaperture such that a connection to the circuitry is accepted bycircuitry of another heatsink base through the aperture from an opposedsecond side of the platform. In some embodiments, the circuitry fixedlysecured on the first side of the platform may include anelectro-mechanical interface that provides access to unused systembusses and resources after deployment in the field.

In some embodiments, the platform of the heatsink base may be a planarstructure forming a partition of an inner cavity within the framestructure. In some embodiments, a first portion of the inner cavity onthe first side of the platform may larger than a second portion of theinner cavity on the second side of the platform. In some embodiments,the frame structure may have a rectangular or square form.

In some embodiments, the frame structure may be shaped to improve theomnidirectional pattern of the one or more RF antenna portions.

FIGS. 1A and 1B illustrate an integrated heatsink and antenna structure100 in accordance with the embodiments. The integrated heatsink andantenna structure 100 may include an RF antenna portion 120 for sendingand receiving wireless communications and heatsink portions 140 a, 140 bconfigured to dissipate thermal energy or heat. In some embodiments, theRF antenna portion 120 may operate to improve the thermal performance ofone or more of the heatsink portions 140 a, 140 b.

The RF antenna portion 120 may be (or may be plated with) aluminum,copper, stainless steel, beryllium copper, phosphor bronze or any othersimilar material or composition. The heatsink portions 140 a, 140 b maybe (or may be plated with) aluminum, copper, or any other material orcomposition suitable for dissipating heat. For example, in anembodiment, the RF antenna portion 120 may be copper and the heatsinkportions 140 a, 140 b may be aluminum.

In the examples illustrated in FIGS. 1A and 1B, the RF antenna portion120 are formed as a planar inverted-F antenna. In particular, the RFantenna portion 120 may include a feed component 102, a ground planecomponent 104, and a radiating component 106. The radiating component106 may have an L-shape, such that one leg of the L extendssubstantially parallel to and is offset from the ground plane component104, while a second leg of the L (e.g., formed after a bend in theradiating component 106) extends substantially perpendicular to thefirst leg toward the ground plane component 104. In addition, one end ofthe second leg may be attached to or integrally formed with the groundplane component 104 at the grounded end 109.

In some embodiments (e.g., embodiments in which an antenna portion 120is not formed as a planar inverted-F antenna, etc.), a monopole could bedesigned with the heat sink as ground reference. Further, someembodiments may include a ground plane independent primary radiator(e.g. dipole, etc.) that uses the heatsink as a field shaping structure(dish on a dish antenna).

Returning to examples illustrated in FIGS. 1A and 1B, the feed component102 may be electrically couple to a computing device (not illustrated),in which the integrated heatsink and antenna structure 100 is included.Also, the feed component 102 may be fixedly secured (e.g., soldered) tothe radiating component 106 at a feed point 112. In this way, the feedcomponent 102 extends from the feed point 112, through an aperture 105in the ground plane component 104, and to a physical connection with thecomputing device. The feed component 102 may include a casing orsheathing 105 that insolates the feed component 102. The feed point 112may be disposed between a shorted portion 108 and a radiating portion110 of the radiating component 106. The shorted portion 108 may extendaway from the feed point 112, substantially parallel to the ground planecomponent 104 until the bend, beyond which the remainder of the shortedportion 108 extends toward the ground plane component 104 such that thegrounded end 109 ends in contact with the ground plane component 104. Inthis way, the shorted portion 108 may be configured to electricallyshort one end of the radiating component 106 to the ground planecomponent 104. The radiating portion 110 may extend away from the feedpoint 112, in the opposite direction from the shorted portion 108,extending substantially parallel to the ground plane component 104, butinclude a remote end that is not attached to any other component orportion of the integrated heatsink and antenna structure 100.

The heatsink portions 140 a, 140 b may each include fin components 114a, 114 b that provide thermal resistance and additional surface area forimproved thermal performance. The first fin of heatsink portion 140 bmay provide capacitive tuning to the open end of the 2.4 GHz patches.This may allow the patches to be smaller that would be the case withoutthe fin.

In various embodiments, the fin components 114 a, 114 b may be (or maybe plated with) aluminum, copper, or any other material or compositionsuitable for dissipating heat. In addition, the fin components 114 a,114 b may be formed of a material suitable for also enhancing one ormore antenna properties (e.g., radiation patterns, radiation efficiency,bandwidth, input impedance, polarization, directivity, gain, beam-width,voltage standing wave ratio, etc.) of the RF antenna portion 120. Agreater or fewer number of fin components 114 a, 114 b may be includedas part of the heatsink portions 140 a, 140 b (i.e., illustrated asellipses on the outer right and left sides of FIG. 1B).

The ground plane component 104 may be coupled to one or more of the fincomponents 114 a, 114 b and/or arranged to dissipate additional thermalenergy and further improve thermal performance, similar to the fincomponents 114 a, 114 b. For example, an innermost one of each of thefin components 114 a, 114 b may include tabs 141 a, 141 b that hold theground plane component 104 in place. Additional components may bias theground plane component 104 into contact with the tabs 141 a, 141 b, thussecuring (i.e., holding) the RF antenna portion 120 and the heatsinkportions 140 a, 140 b together. Alternatively, a clip or slot may beprovided on or in the innermost ones of the fin components 114 a, 114 bfor securing the ground plane component 104 to the fin components 114 a,114 b. In this way, securing the ground plane component 104 to the fincomponents 114 a, 114 b couples the RF antenna portion 120 to theheatsink portions 140 a, 140 b. Also, this coupling may produce asynergistic effect of providing an RF antenna portion 120 that improvesthe thermal performance of the heatsink portions 140 a, 140 b, as wellas heatsink portions 140 a, 140 b that improve the antenna properties ofthe RF antenna portion 120.

The computing device, in which the integrated heatsink and antennastructure 100 is included, may dissipate the same amount of heat and/orachieve the same thermal performance as conventional devices that havelarger structures that include larger or a greater number of fincomponents that occupy more area. In accordance with variousembodiments, the integrated heatsink and antenna structure 100 may bepackaged into a smaller or more compact container and/or to includeadditional or more powerful components (e.g., additional antennas, morepowerful processors that generate more heat, etc.) than conventionaldevices.

FIGS. 2A-2C illustrate an integrated heatsink and antenna structure 200that includes multiple sets of the integrated heatsink and antennastructure 100 described above with regard to FIGS. 1A and 1B, inaccordance with some embodiments. The integrated heatsink and antennastructure 200 may include a cavity 212 onto which a processor, computingsystem, printed circuit board, integrated circuit (IC) chips, a systemon chip (SOC), or system in a package (SIP) and/or other similarcomponents may be implemented or placed. In some embodiments, theintegrated heatsink and antenna structure 200 may include a connectorport 202 that provides an interface between components of the integratedheatsink and antenna structure 200 (or components of the computingdevice, base unit, etc.) and other computers or peripheral devices. Theconnector port 202 may include an electro-mechanical interface such thatunused system busses and resources of the device may be accessed and/orretro-fitted by the end user, after deployment, or in the field. Theconnector port 202 may allow additional units to be attached in avariety of different ways and/or to form a variety of differentconfigurations. Once attached, the combined unit (i.e., the base unitand the attached additional units) may operate as a single unifiedcomputing device. The additional units may expand or enhance thebaseline feature set of the computing device by adding to the existingmemory, processing, and/or communication resources placed on the cavity212. The additional units may also expand the baseline feature set byadding new resources or capabilities, such as support for a new radioaccess technology, decoding audio, processing light, receiving externalinputs, adding external relay contacts to, for example, turn otherdevices on or off, receive inputs from external devices, etc.

In the example illustrated in FIG. 2A, the connector port 202 isrepresented as a port that supports horizontal stacking. However, itshould be understood that in the various embodiments, the connector port202 may include multiple ports that each support horizontal (orvertical) stacking.

In some embodiments, the integrated heatsink and antenna 200 may includemultiple antennas. In the illustrated examples, the integrated heatsinkand antenna structure 200 includes eight (8) RF antenna portions 120 a-hcoupled to a heatsink base 210. The heatsink base 210 may be configured,shaped or arranged to improve the omnidirectional pattern of the antennaportions (120 a-h).

Each of the RF antenna portions 120 a-h may be coupled to and surroundedby fin components (e.g., 114 a-d) integrated into the heatsink base 210and that dissipate thermal energy. For example, four (4) of the RFantenna portions 120 a, 120 c, 120 e, 120 g may be disposed on the sidesof the integrated heatsink and antenna structure 200, each having asimilar configuration to that described with regard to integratedheatsink and antenna structure 100 in FIGS. 1A and 1B. In contrast, four(4) more of the RF antenna portions 120 b, 120 d, 120 f, 120 h may bedisposed on the corners of the integrated heatsink and antenna structure200, each flanked by sets of fin components (e.g., 114 b, 114 c), butthose flanking fin components may be disposed on two different sides ofthe integrated heatsink and antenna structure 200.

As mentioned above, the integrated heatsink and antenna structure 200may include a cavity 212 onto which a processor, computing system,printed circuit board, integrated circuit (IC) chips, a system on chip(SOC), or system in a package (SIP) and/or other similar components maybe implemented or placed, and a connector port 202 that provides aninterface between those components/chips (e.g., processors, ICs, SOC,SIP, etc.) and corresponding components on other or additional units. Asalso mentioned above, the connector port 202 may include multiple portsthat each support stacking one or more additional units or components(i.e., there may be additional connector ports proving interfaces,etc.). In some embodiments, the components/chips may be placed on a heatconducting material (not illustrated separately in FIGS. 2A-C) that isplaced on top of the cavity 212 (or aluminum housing) to help with theheat transfer and to address any imperfections that arise duringmanufacturing.

In some embodiments, the integrated heatsink and antenna structure 200may configured, formed, or arranged to dissipate between approximately15 to 20 Watts/mm² (or Watts/inch) from the chip to the integratedheatsink and antenna structure 200, from the integrated heatsink andantenna structure 200 to ambient air, and/or from the chip to ambientair.

As mentioned above, the integrated heatsink and antenna structure 200may include multiple RF antennas 120 a-h. The RF antennas 120 a-h mayinclude wideband, multiband, and/or ultrawideband (UWB) antennas. Forexample, the RF antennas 120 a-h may include patch antennas, inverted-Lantennas, inverted-F antennas (e.g., planar inverted-F antenna (PIFA),dual frequency PIFA, etc.) or any other antenna suitable for wirelessapplications. In some embodiments, the RF antennas 120 a-h and/or theantenna pattern may be selected based on heatsink characteristics (size,area, amount of heat metal, etc.).

As mentioned above, securing the ground plane component 104 to the fincomponents 114 a, 114 b couples the RF antenna portions 120 to theheatsink portion. In the various embodiments, the ground plane for anyof the RF antenna portions 120 may be changed so that it is potentiallysmaller than shown in the figures, but running the entire length behindthe heatsink fin components 114.

In some embodiments, the fin components 114 may be arranged into a finstructure that is slightly different for each RF antenna portion 120 a-hor for each antenna location. In some embodiments, each of the RFantenna portions 120 may be tuned for frequency band and/or modifiedbased on frequency, bandwidth, impedance, proximity to the fincomponents 114 and/or the corresponding fin structure.

FIG. 3 illustrates a partially exploded view of the integrated heatsinkand antenna structure 200. As shown, the RF antenna portions 120 a-h maybe separated from and/or attached to the heatsink base component 210using securing structures incorporated into some of the fin components.

In some embodiment, the antenna elements/portions may be formed curvedof a springy material. The heat sink features may hold the antennaelements/portions flat so that so friction (primarily) holds them inplace. As such, the RF antenna portions 120 a-h may be attached to theheatsink base component 210 via a friction fit. In addition, theintegrated heatsink and antenna structure 200 may be formed to fit intoa plastic housing (not illustrated separately in FIG. 3) that hasfeatures that ensure location of the radiating element so that theantennas do not become detuned by having the structure bent out ofshape.

FIG. 4 illustrates the heatsink base component 210 in accordance withvarious embodiments. In particular, FIG. shows some of the retainingstructures that may be incorporated into some of the fin components forholding and retaining the RF antenna portions (e.g., 120 a-h). Forexample, the corner fin components may have hooked ends 441 such thatthe hooked ends 441 on a pair of opposed corner fin components may bendtoward one another. The hooked ends 441 may be used to trap an RFantenna portion. The RF antenna portion may also be supported by cornermini-fins 451 that project out toward the RF antenna portion. In thisway, each of the RF antenna portions on the corners of the heatsink basecomponent 210 may be trapped between a pair of the hooked ends 441 and aset of the corner mini-fins 451. Similarly, the RF antenna portions onthe sides of the heatsink base component 210 may be trapped between apair of the tabs 141 a, 141 b and a set of additional mini-fins 453.

FIGS. 5A and 5B illustrate a stackable housing 500 for an integratedheatsink and antenna structure in accordance with some embodiments. Thestackable housing 500 may include a lid 510, an upper rim 520, an uppertray 530, a housing casing 540, housing base 550, and housing feet 555.In accordance with various embodiments, the integrated heatsink andantenna structure (e.g., integrated heatsink and antenna 200 illustratedin FIG. 2A, etc.) may be seated on top of the housing base 550. Once theintegrated heatsink and antenna structure 200 is mounted on the housingbase 550, the housing casing 540 may be slipped over and surround theintegrated heatsink and antenna structure 200. The lid 510, upper rim520, and upper tray 530 may then close off the assembly by being securedon top of the housing casing 540. Additional components and/or circuitrymay be located between the integrated heatsink and antenna structure andthe housing base 550. Similarly, components and/or circuitry may belocated between the lid 510 and the upper tray 530.

In various embodiments, the stackable housing 500 may be stacked on topof, on the side of, or below another stackable housing 500, which thenallows multiple integrated heatsink and antenna structures (e.g., 200)to be used together in a compact arrangement. To stack the stackablehousings 500, the lid 510, upper rim 520, and upper tray 530 of all butthe uppermost stackable housing 500 may be removed so as to expose oneintegrated heatsink and antenna structure below to another integratedheatsink and antenna structure above.

FIG. 6A illustrates a combined unit 600 that includes a base unit 620and an additional unit 622 stacked on top of and coupled to one anotherin accordance with some embodiments.

FIG. 6B illustrates a combined unit 602 that includes a base unit 620and two additional units 622, 624. In the example illustrated in FIG.6B, one additional unit 624 is stacked on top of the base unit 620, andanother additional unit 622 is stacked below the base unit 620. However,it should be understood that the base unit 620 and the additional units622-624 may be attached in a variety of different ways and/or to form avariety of different configurations in some embodiments.

FIG. 6C illustrates a combined unit 604 that includes that a base unit620 may include two additional units 622, 624 stacked on top of the baseunit 620, and two additional units 626, 628 attached to the sides of thebase unit 620.

FIG. 6D illustrates a combined unit 606 that includes a base unit 620may include two additional units 622, 624 stacked on top of the baseunit 620 and another two additional units 626, 628 stacked on the sidesof the base unit 620. Each of the additional units 626 and 628 mayinclude another additional unit 630, 632 stacked on top.

FIGS. 7A and 7B illustrates an example computing system 700 that may beused with integrated heatsink and antenna structure 200 in accordancewith some embodiments. In the example illustrated in FIG. 7, thecomputing system 700 includes an SOC 702, a clock 704, and a voltageregulator 706.

In overview, an SOC may be a single IC chip that contains multipleresources and/or processors integrated on a single substrate. A singleSOC may contain circuitry for digital, analog, mixed-signal, andradio-frequency functions. A single SOC may also include any number ofgeneral purpose and/or specialized processors (packet processors, etc.),memory blocks (e.g., ROM, RAM, Flash, etc.), and resources (e.g.,timers, voltage regulators, oscillators, etc.). SOCs may also includesoftware for controlling the integrated resources and processors, aswell as for controlling peripheral devices. The components in an SOC maygenerate a significant amount of thermal energy or heat, and thus theplacement of the components within the SOC, the location of the SOCwithin the integrated heatsink and antenna structure 200, and otherthermal management considerations are often important.

With reference to FIG. 7A, the SOC 702 may include a digital signalprocessor (DSP) 708, a modem processor 710, a graphics processor 712, anapplication processor 714 connected to one or more of the processors,memory 716, custom circuitry 718, system components and resources 720, athermal management unit 722, and an interconnection/bus module 724. TheSOC 702 may operate as central processing unit (CPU) that carries outthe instructions of software application programs by performing thearithmetic, logical, control and input/output (I/O) operations specifiedby the instructions.

The thermal management unit 722 may be configured to monitor and managethe device's junction temperature, surface/skin temperatures and/or theongoing consumption of power by the active components that generatethermal energy in the device. The thermal management unit 722 maydetermine whether to throttle the performance of active processingcomponents (e.g., CPU, GPU, LCD brightness), the processors that shouldbe throttled, the level to which the frequency of the processors shouldbe throttled, when the throttling should occur, etc.

The system components and resources 720 and custom circuitry 718 maymanage sensor data, analog-to-digital conversions, wireless datatransmissions, and perform other specialized operations, such asdecoding data packets and processing video signals. For example, thesystem components and resources 720 may include power amplifiers,voltage regulators, oscillators, phase-locked loops, peripheral bridges,temperature sensors (e.g., thermally sensitive resistors, negativetemperature coefficient (NTC) thermistors, resistance temperaturedetectors (RTDs), thermocouples, etc.), semiconductor-based sensors,data controllers, memory controllers, system controllers, access ports,timers, and other similar components used to support the processors andsoftware clients running on a device. The custom circuitry 718 may alsoinclude circuitry to interface with other computing systems andperipheral devices, such as wireless communication devices, externalmemory chips, etc.

Each processor 708, 710, 712, 714 may include one or more cores, andeach processor/core may perform operations independent of the otherprocessors/cores. For example, the SOC 702 may include a processor thatexecutes a first type of operating system (e.g., FreeBSD, LINUX, OS X,etc.) and a processor that executes a second type of operating system(e.g., MICROSOFT WINDOWS 10). In addition, any or all of the processors708, 710, 712, 714 may be included as part of a processor clusterarchitecture (e.g., a synchronous processor cluster architecture, anasynchronous or heterogeneous processor cluster architecture, etc.).

The processors 708, 710, 712, 714 may be interconnected to one anotherand to the memory 718, system components and resources 720, and customcircuitry 718, and the thermal management unit 722 via theinterconnection/bus module 724. The interconnection/bus module 724 mayinclude an array of reconfigurable logic gates and/or implement a busarchitecture (e.g., CoreConnect, AMBA, etc.). Communications may beprovided by advanced interconnects, such as high-performance networks-onchip (NoCs).

The SOC 702 may further include an input/output module (not illustrated)for communicating with resources external to the SOC, such as the clock704 and the voltage regulator 706. Resources external to the SOC (e.g.,clock 704, etc.) may be shared by two or more of the internal SOCprocessors/cores.

In addition to the SOC 702 discussed above, the various embodiments mayinclude or may be implemented in a wide variety of computing systems,which may include a single processor, multiple processors, multicoreprocessors, or any combination thereof.

With reference to FIG. 7B, the computing system 700 may include a stackconnector 734, which may correspond to and/or may be used in conjunctionwith the connector port 202 illustrated in FIGS. 2A, 2B, and 4. Thestack connector 734 may include interconnection/bus module with variousdata and control lines for communicating with the SOC 702. The stackconnector 734 may also expose systems buses and resources of a SOC 702or computing device 700 in a manner that allows the chip or computingsystem to attach to an additional unit to include additional features,functions or capabilities, but which preserves the performance andintegrity of the original SOC 702 or computing device 700.

The stackable units (modules) may also be stacked vertically (as shownin FIGS. 6A-6D, 8 and 10) and/or may be coupled or stacked horizontally(as shown in FIGS. 6C, 6D, 8 and 10). FIGS. 6A-6D, 8 and 10 alsoillustrate that additional units may be coupled to or stacked above,below, or to the sides of a base unit to create various differentconfigurations or computing architectures.

FIG. 9 illustrates that each unit may expose multiple interfaces. Inparticular, FIG. 9 illustrates that the unit may expose an interface oneach of its sides. There may be more than one connector for each side ofthe unit allowing for different interfaces to take place. Differentinterfaces like power where additional power is drawn into thecollective array from an add on unit. The add on unit can also be usedas a solar array using a quantum array or implement another energyharvesting method where the unit provides an additional power source.

In some embodiments, the stack connector 734 or connector port 202 mayinclude or may be associated with an electro-mechanical interface thatallows unused system busses and resources to accessed and/orretro-fitted by the end user, after deployment, or in the field. Theadditional units can also have a connector used for heat transferallowing for an integrated heat sink between units. The units can alsohave a heat conveyance tube or channel where the connector acts not onlyas an electrical and or optical interface but also as a heat sinkdrawing heat from one unit to another for dissipation.

The connectors (grey) shown in FIG. 9 can be covered by a shroud wherethe shroud needs to be removed in order to gain access to theinterfaces.

Some embodiments may include a stackable computing device that includesa connector port (e.g., stack connector 734 or connector port 202) thatexposes system busses and resources in a manner that allows anothercomputing system or accessory to be stacked on top of the computingdevice. In some embodiments, the computing device may include anintegrated heatsink and antenna structure having a cavity (e.g., cavity212, etc.) suitable for housing the connector port.

Some embodiments may include module or component connected to acomputing device that exposes a system bus, exposes and connects toother modules/components and provides power, exposes a power source forconnected modules/components, exposes external interfaces with themodules/components, provides a stackable design that allows for side orhorizontal stacking of components, provides heat dissipation through thestackable design, and/or provides a quantum computing interface withbase unit and other modules/components.

Some embodiments may include a heatsink base that includes a framestructure, a plurality of fin components projecting outwardly from theframe structure (in which the plurality of fin components are configuredto receive and hold one or more RF antenna portions), and a platformsubstantially surrounded by the frame structure. In some embodiments,the platform may include a connector port formed as an apertureextending through the platform. In some embodiments, the platform may beconfigured to have circuitry fixedly secured on a first side of theplatform with a connector of the circuitry aligned with the aperturesuch that a connection to the circuitry can be made by circuitry ofanother heatsink base through the aperture from an opposed second sideof the platform. In some embodiments, the platform may be a planarstructure forming a partition of an inner cavity (e.g., cavity 212,etc.) within the frame structure. In some embodiments, a first portionof the inner cavity (e.g., cavity 212, etc.) on the first side of theplatform may be larger than a second portion of the inner cavity (e.g.,cavity 212, etc.) on the second side of the platform. In someembodiments, the frame structure may have a rectangular or square form.

Some embodiments may include an integrated heatsink and antenna housingthat includes a housing casing, a housing cover and a housing base.

The housing casing may be configured to surround a first integratedheatsink and antenna structure removably secured therein. The housingcasing may also form an inner cavity for holding the first integratedheatsink and antenna structure.

The housing cover may be removably secured to a top side of the housingcasing such that when secured to the topside of the housing casing, thehousing cover conceals the inner cavity from view from the top side ofthe housing casing.

The housing base may be removably secured to a bottom side of thehousing casing, so that when secured to the bottom side of the housingcasing, the housing base conceals the inner cavity from view from thebottom side of the housing casing. In addition, the housing base may beconfigured to that removal of at least one of the housing cover or thehousing base allows a second integrated heatsink and antenna structuresecured with another integrated heatsink and antenna housing to bestacked with and coupled to the first integrated heatsink and antennastructure secured with the housing casing.

Some embodiments may include a stackable computing device that includesa base unit configured, shaped, formed or arranged so that the customeror user can quickly physically attach additional units (e.g., anauxiliary unit, another base unit, etc.) above, below, or to the sidesof the base unit to form various different configurations or computerarchitectures.

Some embodiments may include a stackable computing device that includesa baseline feature set, and an expandable architecture that allows endusers to add specific features or functionality (e.g., digitalconcierge, home assistant, etc.) to the device as needed.

Some embodiments may include a stackable computing device (e.g., edgedevice, etc.) that includes an electro-mechanical interface that allowsunused system busses and resources to be accessed and/or retro-fitted bythe end user, after deployment, and/or in the field. In someembodiments, the electro-mechanical interface may be positioned on thetop or bottom of the computing device to support vertical stacking. Insome embodiments, the electro-mechanical interface may be positioned onthe side of the stackable computing device to support horizontal stacks.In some embodiments, the stackable computing device may include aninterface plug connected to the exposed electro-mechanical interface andconfigured to facilitate different connection and interface options. Insome embodiments, the interface plug may include hardware configured toperform protocol and/or level conversion.

In some embodiments, the stackable computing device may include a LTEand or 5G module.

In some embodiments, the stackable computing device may include Powerover Ethernet (POE), which may be used to obtain power from ethernet andavoid wall warts (e.g., addition of power outlet to support mounting thedevice on the wall, etc.).

In some embodiments, the stackable computing device may be mountedvertically and horizontally.

In some embodiments, the stackable computing device may include multipleinterfaces to connect to different devices or antennas (e.g., LTE/5Gantennas, GPS antenna, etc.).

In some embodiments, the stackable computing device may includeaugmented reality or virtual reality components. In some embodiments,the stackable computing device may include closed-circuit television(CCTV), quantum cameras, and/or micro LED cameras. In some embodiments,the stackable computing device may include multiple camera or videocomponent that provide the device with 360 degree view of itssurroundings.

In some embodiments, the stackable computing device may include a solararray for power or augmentation of power.

In some embodiments, the stackable computing device may be coupledoptically or via wireless to enable expansion of capability forenhancing the computing capability and functionality.

In some embodiments, the stackable computing device may be self aware sothat it may interact with other stacker units to optimize and betterutilize the shared power system.

In various embodiments, the stackable computing device may be arrangedhorizontally, vertically, or a combination thereof. For example, thestacker units may be arranged both vertically and horizontally in asingle configuration.

In various embodiments, the stackable computing device may be configuredso that it may be detached from the other stacker units as a hot swapfunction.

In various embodiments, the stackable computing device may be include apersonality profile associated with each facilitating a common stackermodule with multiple functions (e.g., instead of making each stackermodule for a specific purpose, etc.).

The processors may be any programmable microprocessor, microcomputer ormultiple processor chip or chips that can be configured by softwareinstructions (applications) to perform a variety of functions, includingthe functions of the various aspects described in this application. Insome wireless devices, multiple processors may be provided, such as oneprocessor dedicated to wireless communication functions and oneprocessor dedicated to running other applications. Typically, softwareapplications may be stored in the internal memory 906 before they areaccessed and loaded into the processor. The processor may includeinternal memory sufficient to store the application softwareinstructions.

As used in this application, the terms “component,” “module,” “system,”and the like may refer to a computer-related entity, such as, but notlimited to, hardware, firmware, a combination of hardware and software,software, or software in execution, which are configured to performparticular operations or functions. For example, a component may be, butis not limited to, a process running on a processor, a processor, anobject, an executable, a thread of execution, a program, and/or acomputer. By way of illustration, both an application running on awireless device and the wireless device may be referred to as acomponent. One or more components may reside within a process and/orthread of execution and a component may be localized on one processor orcore and/or distributed between two or more processors or cores. Inaddition, these components may execute from various non-transitorycomputer readable media having various instructions and/or datastructures stored thereon. Components may communicate by way of localand/or remote processes, function or procedure calls, electronicsignals, data packets, memory read/writes, and other known network,computer, processor, and/or process related communication methodologies.

Various aspects illustrated and described are provided merely asexamples to illustrate various features of the claims. However, featuresshown and described with respect to any given aspect are not necessarilylimited to the associated aspect and may be used or combined with otheraspects that are shown and described. Further, the claims are notintended to be limited by any one example aspect. For example, one ormore of the operations of the methods may be substituted for or combinedwith one or more operations of the methods.

The foregoing method descriptions and the process flow diagrams areprovided merely as illustrative examples and are not intended to requireor imply that the operations of various aspects must be performed in theorder presented. As will be appreciated by one of skill in the art theorder of operations in the foregoing aspects may be performed in anyorder. Words such as “thereafter,” “then,” “next,” etc. are not intendedto limit the order of the operations; these words are used to guide thereader through the description of the methods. Further, any reference toclaim elements in the singular, for example, using the articles “a,”“an,” or “the” is not to be construed as limiting the element to thesingular.

Various illustrative logical blocks, modules, components, circuits, andalgorithm operations described in connection with the aspects disclosedherein may be implemented as electronic hardware, computer software, orcombinations of both. To clearly illustrate this interchangeability ofhardware and software, various illustrative components, blocks, modules,circuits, and operations have been described above generally in terms oftheir functionality. Whether such functionality is implemented ashardware or software depends upon the particular application and designconstraints imposed on the overall system. Skilled artisans mayimplement the described functionality in varying ways for eachparticular application, but such aspect decisions should not beinterpreted as causing a departure from the scope of the claims.

The hardware used to implement various illustrative logics, logicalblocks, modules, and circuits described in connection with the aspectsdisclosed herein may be implemented or performed with a general purposeprocessor, a digital signal processor (DSP), an application specificintegrated circuit (ASIC), a field programmable gate array (FPGA) orother programmable logic device, discrete gate or transistor logic,discrete hardware components, or any combination thereof designed toperform the functions described herein. A general-purpose processor maybe a microprocessor, but, in the alternative, the processor may be anyconventional processor, controller, microcontroller, or state machine. Aprocessor may also be implemented as a combination of receiver smartobjects, e.g., a combination of a DSP and a microprocessor, a pluralityof microprocessors, one or more microprocessors in conjunction with aDSP core, or any other such configuration. Alternatively, someoperations or methods may be performed by circuitry that is specific toa given function.

In one or more aspects, the functions described may be implemented inhardware, software, firmware, or any combination thereof. If implementedin software, the functions may be stored as one or more instructions orcode on a non-transitory computer-readable storage medium ornon-transitory processor-readable storage medium. The operations of amethod or algorithm disclosed herein may be embodied in aprocessor-executable software module or processor-executableinstructions, which may reside on a non-transitory computer-readable orprocessor-readable storage medium. Non-transitory computer-readable orprocessor-readable storage media may be any storage media that may beaccessed by a computer or a processor. By way of example but notlimitation, such non-transitory computer-readable or processor-readablestorage media may include RAM, ROM, EEPROM, FLASH memory, CD-ROM orother optical disk storage, magnetic disk storage or other magneticstorage smart objects, or any other medium that may be used to storedesired program code in the form of instructions or data structures andthat may be accessed by a computer. Disk and disc, as used herein,includes compact disc (CD), laser disc, optical disc, digital versatiledisc (DVD), floppy disk, and Blu-ray disc where disks usually reproducedata magnetically, while discs reproduce data optically with lasers.Combinations of the above are also included within the scope ofnon-transitory computer-readable and processor-readable media.Additionally, the operations of a method or algorithm may reside as oneor any combination or set of codes and/or instructions on anon-transitory processor-readable storage medium and/orcomputer-readable storage medium, which may be incorporated into acomputer program product.

The preceding description of the disclosed aspects is provided to enableany person skilled in the art to make or use the claims. Variousmodifications to these aspects will be readily apparent to those skilledin the art, and the generic principles defined herein may be applied toother aspects without departing from the scope of the claims. Thus, thepresent disclosure is not intended to be limited to the aspects shownherein but is to be accorded the widest scope consistent with thefollowing claims and the principles and novel features disclosed herein.

What is claimed is:
 1. A computing device, comprising: an integratedheatsink and antenna structure that includes a heatsink base and one ormore radio frequency (RF) antenna portions; and a housing structure thatincludes a housing casing that surrounds the integrated heatsink andantenna structure, wherein the heatsink base of the integrated heatsinkand antenna structure includes a connector port that provides aninterface between components of the computing device and other computingor peripheral devices.
 2. The computing device of claim 1, wherein theconnector port includes an electro-mechanical interface that providesaccess to unused system busses and resources of the computing deviceafter deployment in the field.
 3. The computing device of claim 1,wherein the connector port is configured to allow additional computingdevices to be stacked onto the computing device to form a combined unitthat operates as a single unified computing device.
 4. The computingdevice of claim 3, wherein the components of the computing device placedon integrated heatsink and antenna structure operate to provide abaseline feature set, and the additional stacked computing devicesexpand or enhance the baseline feature set by adding to the memory,processing, or communication resources to the computing device.
 5. Thecomputing device of claim 3, wherein the connector port is configured toallow the computing device and the additional computing devices to use acommon communication and power bus interface.
 6. The computing device ofclaim 1, wherein the one or more RF antenna portions include at leastone or more of: a long term evolution (LTE) antenna portion; a fourthgeneration wireless mobile communication technology (4G) antennaportion; a fifth generation wireless mobile communication technology(5G) antenna portion; or a global positioning system antenna portion. 7.A housing structure, comprising: a housing casing configured to surroundan integrated heatsink and antenna structure removably secured therein,wherein the housing casing forms an inner cavity for holding theintegrated heatsink and antenna structure; a housing cover removablysecured to a top side of the housing casing, wherein, when secured tothe topside of the housing casing, the housing cover conceals the innercavity from view from the top side of the housing casing; a housing baseremovably secured to a bottom side of the housing casing, wherein, whensecured to the bottom side of the housing casing, the housing baseconceals the inner cavity from view from the bottom side of the housingcasing, wherein removal of at least one of the housing cover or thehousing base allows an additional unit to be stacked with and coupled tothe integrated heatsink and antenna structure secured with the housingcasing.
 8. The housing structure of claim 7, wherein the housing casingis configured to surround an integrated heatsink and antenna structurethat includes a heatsink base and one or more radio frequency (RF)antenna portions.
 9. The housing structure of claim 7, wherein thehousing casing is configured to surround an integrated heatsink andantenna structure that includes a connector port that provides aninterface between components of the integrated heatsink and antennastructure and other computers or peripheral devices.
 10. The housingstructure of claim 7, wherein removal of at least one of the housingcover or the housing base allows a computing device to be stacked withand coupled to the integrated heatsink and antenna structure securedwith the housing casing.
 11. The housing structure of claim 7, whereinremoval of at least one of the housing cover or the housing base allowsa second integrated heatsink and antenna structure cased in a secondhousing to be stacked with and coupled to the integrated heatsink andantenna structure secured with the housing casing.
 12. The housingstructure of claim 7, wherein: the integrated heatsink and antennastructure includes a cavity onto which at least one of a processor, acomputing system, a printed circuit board, an integrated circuit (IC)chip, a system on chip (SOC), or a system in a package (SIP) may placed;and the housing casing is configured to surround the integrated heatsinkand antenna structure and the at least one processor, computing system,printed circuit board, integrated circuit (IC) chip, system on chip(SOC), or system in a package (SIP) placed onto the cavity of theintegrated heatsink and antenna.
 13. The housing structure of claim 7,wherein the housing casing is configured to surround an integratedheatsink and antenna structure that includes a radio frequency antennaportion and a heatsink portion, the radio frequency antenna portionoperates to improve the thermal performance of the heatsink portion, andthe heatsink portion operates to improve one or more antenna propertiesof the radio frequency antenna portion.
 14. A heatsink base, comprising:a frame structure; a plurality of fin components projecting outwardlyfrom the frame structure, wherein the plurality of fin components areconfigured to receive and hold one or more radio frequency (RF) antennaportions; and a platform substantially surrounded by the framestructure, wherein the platform includes an aperture extending throughthe platform to support a connector port, wherein the platform isconfigured to have circuitry fixedly secured on a first side of theplatform with a connector of the circuitry aligned with the aperturesuch that a connection to the circuitry is accepted by circuitry ofanother heatsink base through the aperture from an opposed second sideof the platform.
 15. The heatsink base of claim 14, wherein the platformis a planar structure forming a partition of an inner cavity within theframe structure.
 16. The heatsink base of claim 15, wherein a firstportion of the inner cavity on the first side of the platform is largerthan a second portion of the inner cavity on the second side of theplatform.
 17. The heatsink base of claim 14, wherein the frame structurehas a rectangular or square form.
 18. The heatsink base of claim 14,wherein the frame structure is shaped to improve the omnidirectionalpattern of the one or more RF antenna portions.
 19. The heatsink base ofclaim 14, wherein the one or more RF antenna portions include at leastone or more of: a long term evolution (LTE) antenna portion; a fourthgeneration wireless mobile communication technology (4G) antennaportion; a fifth generation wireless mobile communication technology(5G) antenna portion; or a global positioning system antenna portion.20. The heatsink base of claim 14, wherein the circuitry fixedly securedon the first side of the platform includes an electro-mechanicalinterface that provides access to unused system busses and resourcesafter deployment in the field.